RAILWAY

Demanding applications like railway, wind energy and medium-voltage drives require efficient semiconductor modules with high power density. Since 60 years Mitsubishi Electric offers continuous innovation in development and production of power semiconductors. Packaging as well as Si and SiC chip technology reach most ambitious targets for high reliability, compact design and high power density.

FEATURES LV100 and HV100 High Voltage Power Modules

• Standardized dual packages with 6 kV and 10.2 kV insulation voltage
• IGBT chips with latest generation CSTBT^TM technology and RFC diodes
• Robust main terminals suitable for doubling the rated module current in case of using SiC-chips
• High power density and low thermal resistance by new MCB (Metal Casting direct Bonding) technology
• High robustness/resistance against environmental influences due to the newly developed SCC (Surface Charge Control) process