Catalogue list POWER
Find a list of the catalogues and flyers for all of our products.
Read them online or download a PDF.
Find a list of the catalogues for all of our products. Read them online or download a PDF.
Mitsubishi Electric power modules are at the forefront of the latest energy innovations that seek to solve global environmental issues while creating a more affluent and comfortable society for all. Some of these innovations are photovoltaic (PV) and wind power generation from renewable energy sources, smart grids realizing efficient supply of power, hybrid/electric vehicles (HVs/EVs) that take the next step in reducing carbon emissions and fuel consumption, and home appliances that achieve ground-breaking energy savings. Whether in appliances, railcars, EVs or industrial systems, our power modules are key elements in changing the way energy is used.
High-voltage integrated circuits (HVICs) are capable of driving the gates of power MOSFETs and IGBTs using signals input from microcomputers, thereby replacing power MOSFET and IGBT gate drivers that use pulse transformers and photocouplers. They are insulated by a level shift circuit inside the semiconductor chip. Since a variety of protection functions, such as power supply undervoltage, interlocking, input signal filter, and error output, are built into the IC, reliability of the power supply equipment is enhanced. Mitsubishi Electric has many half-bridge products that are commonly used in drive circuits. Our HVIC products comply with the European Union’s Restriction of Hazardous Substances Directive for electrical equipment, 2011/65/EU and 2015/863/EU.
Find a list of the flyers for all of our products. Read them online or download a PDF.
High-voltage modules are essential for power systems that require large capacity, high reliability and maximum efficiency. Mitsubishi Electric’s first HVIGBT module, which was commercialized in 1997, enabled the development of larger capacity and smaller sized high-voltage converter systems. The X-series HVIGBT modules feature 7th Generation Insulated Gate Bipolar Transistors (IGBT) and Relaxed Field of Cathode (RFC) diodes.
For traction and heavy industry, the newly developed next-generation dual power modules in LV100 and HV100 package enable robust and high power density inverters. The line-up covers all relevant voltage classes from 1700 V up to 6500 V. Parallel connection of modules is simplified by according terminal positions and the internal package structure. This and providing at least two different current ratings for each voltage class give converter designers higher flexibility for their individual projects. For highest efficiency requirements and cutting-edge converter systems, cutting-edge Full-SiC and Hybrid-SiC technology will be available in the same package.
High power applications in the field of renewable energy and industry require reliable, scalable and standardized power modules. Providing optimized solutions, Mitsubishi Electric is expanding the line-up of the standardized LV100 package to 1200V, 1700V and 2000V blocking voltages by utilization of proven SLC package and 7th Gen. IGBT/Diode chips technology.
Applications like battery chargers, welding, medical, or industrial power supplies operating at higher switching frequency in the range of several tens of kHz require power modules with optimized fast switching semiconductors and package layouts. Mitsubishi Electric is offering various products based on Si IGBT and SiC Technologies.
The Mitsubishi Electric 7th Generation NX-Type IGBTs greatly simplify the design of medium power inverters for various applications like industrial drives, wind power, solar power and UPS. Features such as an industry standard low profile package, significantly improved thermal impedance and very low loss, 7th Generation CSTBTTM technology facilitate a very efficient, economical and robust inverter design.
The new Mitsubishi Electric 7th Generation Standard-Type IGBTs for 650V, 1200V and 1700V have been developed for the purpose of highest power density inverters and best-in-class thermal behavior. The new 7th Generation CSTBTTM and diode chip set provides high efficiency by reducing both dynamic and static losses. The innovative TMS packaging technology provides very low thermal impedance, low package inductance and high thermal cycling capacity. The new Mitsubishi Electric Standard-Type modules facilitate a high performance and reliability and compact inverter design.
Mitsubishi Electric has developed a novel family of compact Intelligent Converter-Inverter-Brake modules. This new DIPIPM+TMseries incorporates optimized IGBT-and FWDi-chips, low voltage and high voltage driver ICs in a compact transfer molded dual-inline package. The new DIPIPM+TMseries provides smart answers to the two key questions a designer faces when developing a new inverter: How to reduce the system cost? How to reduce the inverter size using compact design?
Mitsubishi Electric has developed a new SLIM package Intelligent Power Module (SLIMDIPTM) for Consumer Goods Applications. Power chips, drive and protection circuits are all integrated into the module, which makes it a simple choice for AC100-200V class motor inverter control. SLIMDIPTM utilizes reverse conducting RC-IGBT technology, which applies Mitsubishi Electric’s latest 7th Generation IGBT chip design, enabling the use of a smaller package by reducing number of internal component when compared to Mitsubishi Electric’s Super Mini DIPIPM series. By virtue of these features SLIMDIPTM is especially suitable for low cost inverterized home appliances and can contribute to system cost reduction.
Mitsubishi Electric has developed new Super Mini Full SiC DIPIPM (hereinafter called Full SiC DIP) for Consumer Goods Applications. Full SIC DIP is an ultra-small compact transfer molded intelligent power module integrating SiC MOSFET chip which is the next generation high efficiency power chips. Power chips, drive and protection circuits are integrated in the module with transfer molding resin.
Mitsubishi Electric has added a new transfer molded SMD type Intelligent Power Module to its line-up – the SOPIPMTM surface mount package IPM (intelligent power module). Applications with small power inverters like pump, fan or low servos are requesting compactness, easy assembling, reliability and high performance. The new SOPIPMTM SMD type IPM combines all the attractive features of Mitsubishi Electric DIPIPM family with the high efficiency RC-IGBT technology (based on Mitsubishi Electric 7th Chip technology). The integration of driver ICs (HVIC and LVIC), bootstrap diodes & limiting-resistors, and protection functions conveniently reduces the inverter design & development time.
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