Catalogue list POWER
Find a list of the catalogues and flyers for all of our products.
Read them online or download a PDF.
Find a list of the catalogues for all of our products. Read them online or download a PDF.
Mitsubishi Electric power modules are at the forefront of the latest energy innovations that seek to solve global environmental issues while creating a more affluent and comfortable society for all. Some of these innovations are photovoltaic (PV) and wind power generation from renewable energy sources, smart grids realizing efficient supply of power, hybrid/electric vehicles (HVs/EVs) that take the next step in reducing carbon emissions and fuel consumption, and home appliances that achieve ground-breaking energy savings.
Traction, industrial equipment, building facilities, electric vehicles, renewable energies, home appliances… Power devices are a key component in power electronics products for contributing to the realization of a low-carbon society. Attracting attention as the most energy-efficient power device is one made using new material, silicon-carbide (SiC). The material characteristics of SiC have led to a dramatic reduction in power loss and significant energy savings for power electronics devices.
Find a list of the flyers for all of our products. Read them online or download a PDF.
The Mitsubishi Electric 7th Generation NX-Type IGBTs greatly simplify the design of medium power inverters for various applications like industrial drives, wind power, solar power and UPS. Features such as an industry standard low profile package, significantly improved thermal impedance and very low loss, 7th Generation CSTBT™ technology facilitate a very efficient, economical and robust inverter design.
The new Mitsubishi Electric 7th Generation Standard-Type IGBTs for650V, 1200V and1700V havebeen developed fo rthe purpose of highest power density inverters and best-in-class thermal behavior. The new 7thGeneration CSTBT™ and diode chip set provides high efficiency by reducing both dynamic and static losses. The innovative TMS packaging technology provides very low thermal impedance, low package inductance and high thermal cycling capacity.
The newly developed next-generation power module called LV100-type X-Series HVIGBT module for traction and electric power applications in heavy industries features higher power density and efficiency for inverters. Moreover, it offers a standardized package that allows a flexible design of inverter systems. Samples of the 3.3kV version of the LV100-type X-Series HVIGBT module (CM450DA-66X & CM600DA-66X) are available. The line-up will be extended by 1.7kV, 3.3kV (HV100), 4.5kV and 6.5kV versions from 2018 onwards.
High-power modules are essential for power systems that require large capacity, high reliability and maximum efficiency. Mitsubishi Electric’s first HVIGBT module, which was commercialized in 1997, enabled the development of larger capacity and smaller sized high-voltage converter systems. The X-Series HVIGBT modules feature 7th-generation insulated gate bipolar transistors (IGBT) and relaxed field of cathode (RFC) diodes.
Mitsubishi Electric has developed a novel family of compact Intelligent Converter-Inverter-Brake modules. This new DIPIPM+TMseries incorporates optimized IGBT-and FWDi-chips, low voltage and high voltage driver ICs in a compact transfer molded dual-inline package.
Mitsubishi Electric has developed a new SLIM package Intelligent Power Module(SLIMDIPTM) for Consumer Goods Applications. Power chips, drive and protection circuits are all integrated into the module, which makes it a simple choice for AC100-200V class motor inverter control. SLIMDIPTM utilizes reverse conducting RC-IGBT technology, which applies MITSUBISHIs latest 7th generation IGBT chip design, enabling the use of a smaller package by reducing number of internal component when compared to MITSUBISHIs Super Mini DIPIPM series.
Mitsubishi Electric has developed New Super Mini Full SiC DIPIPM (hereinafter called Full SiC DIP) for Consumer Goods Applications. Full SIC DIP is an ultra-small compact transfer molded intelligent power module integrating SiC MOSFET chip which is the next generation high efficiency power chips. Power chips, drive and protection circuits are integrated in the module with transfer molding resin.
Mitsubishi Electric has added a new transfer molded SMD type Intelligent Power Module to its line-up – the MISOP™ (Mitsubishi Electric Intelligent Small Outline Power Module) . Applications with small power inverters like pump, fan or low servos are requesting compactness, easy assembling, reliability and high performance.
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